Wafer stage position calibration method and system
US7142314B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2003 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Nov 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of calibrating a positioning stage includes placing a substrate on the positioning stage. The substrate has a contrast film above a portion of the substrate. At least one pattern is at a predetermined location above the substrate, corresponding to a predetermined location on the positioning stage if the positioning stage has zero offset from a registration position. A beam is applied to a position where the pattern on the substrate would be located if the positioning stage has zero offset. At least one of the group consisting of reflected, transmitted and scattered portions of the beam is measured. Whether the positioning stage has a non-zero offset is detected based on the measured portion of the beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.