System and method for integrating subcircuit models in an integrated power grid analysis environment
US7143022B1 · kind B1 · utility
3Cited by
9References
42Claims
0Family size
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Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Jul 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY04S40/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method for integrating a plurality of subcircuit grids in a simulation environment. Upon obtaining a subcircuit layer of a particular granularity for each logical component of an electrical entity (e.g., a semiconductor die in a package and board environment), the nodes of a first subcircuit layer are interconnected to the nodes of a second subcircuit layer using a constraint-based search process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.