Methods and devices for supporting substrates using fluids
US7144299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2005 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | May 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.