Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method
US7144472B2 · kind B2 · utility
5Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Aug 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A production method capable of stably producing a prepreg and a copper foil with thin insulating layer using a thin backbone material capable of securing excellent laser hole-making property. A method for producing a prepreg for use in producing a printed wiring board having a backbone material impregnated with a thermosetting resin comprising the following steps is adopted:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.