Method for thermally treating a substrate that comprises several layers
US7144747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Jul 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of thermally treating a substrate that has multiple layers is provided. A substrate layer that is covered on opposite sides is oxidized from side edges thereof toward a center thereof such that, via the following steps, a defined central portion is not oxidized. The substrate is heated in a process chamber to a prescribed treatment temperature. A hydrogen-rich water vapor is introduced into the process chamber for a specified period of time, wherein such introduction is effected prior to, during and/or after the step of heating the substrate to the prescribed temperature. After conclusion of the specified period of time, introduced into the process chamber is one of the group consisting of: dry oxygen, namely pure oxygen in the form of at least one of atomic O, molecular O2 and O3; a mixture of oxygen and an inert gas that does not chemically react with the layers of the substrate; an oxygen-containing compound that contains no water; and an oxygen-rich water vapor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.