Preconditioning via plug material for a via-in-pad ball grid array package
US7147141B2 · kind B2 · utility
2Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2002 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Aug 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.