Patent · US Expired

System and method for the probing of a wafer

US7148716B2 · kind B2 · utility

5Cited by

12References

8Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Glenn Schuette · Allen, US
James E. Rousey · Lucas, US
Curtis Miller · Wylie, US

Key dates

Filing date	Jun 10, 2004
Grant date	Dec 12, 2006
Priority date	—
Expiry date	Jun 10, 2024

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2834
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.