Integrated process condition sensing wafer and data analysis system
US7149643B2 · kind B2 · utility
10Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jun 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. A process condition measuring device surveys conditions in a target environment and records them in a memory for later transmission or downloading.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.