Method and apparatus for accurate on-die temperature measurement
US7149645B2 · kind B2 · utility
56Cited by
1References
32Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jan 16, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K3/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device and method for continually monitoring multiple thermal sensors located at hotspots across a processor. The sensors are connected to a sensor cycling and selection block located at a periphery of the die. The output from the sensor selection block is converted into a digital temperature code. Based on the digital temperature code, thermal events trigger various thermal controls. The thermal event triggers may be software-programmable, providing flexible temperature management.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.