Electroplating compositions and methods
US7151049B2 · kind B2 · utility
12Cited by
27References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | Nov 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.