Kai Wang
8Patents
2h-index
17Co-inventors
44Inventor score
Filing activity: Apr 2, 2004 → Mar 22, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7151049B2 | Electroplating compositions and methods | Electricity | 12 | Expired |
| US7780771B2 | Metallization of dielectrics | Emerging Cross-Sectional Technologies | 2 | Active |
| US12406999B2 | Positive electrode material, electrochemical device that uses same, and electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11424421B2 | Bio-molecular engineering strategy for efficient perovskite materials and devices | Emerging Cross-Sectional Technologies | 0 | Active |
| US10543498B2 | Sealant coating nozzle and sealant coating apparatus | Performing Operations; Transporting | 0 | Active |
| US9663865B2 | Catalyst structure for electrolysis of water and method of forming the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11611068B2 | Cathode material and electrochemical device comprising the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US12126016B2 | Positive electrode material, electrochemical device containing same, electronic device, and method for preparing the positive electrode material | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.