Method for fabricating electrical connection structure of circuit board
US7151050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2005 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.