Wen-Hung Hu
19Patents
4h-index
7Co-inventors
49Inventor score
Filing activity: Mar 15, 2005 → May 20, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7705456B2 | Semiconductor package substrate | Electricity | 32 | Active |
| US7705471B2 | Conductive bump structure of circuit board and method for forming the same | Electricity | 7 | Active |
| US9295150B2 | Method for manufacturing a printed circuit board | Emerging Cross-Sectional Technologies | 4 | Active |
| US7608929B2 | Electrical connector structure of circuit board and method for fabricating the same | Emerging Cross-Sectional Technologies | 4 | Active |
| US7350298B2 | Method for fabricating circuit board with conductive structure | Emerging Cross-Sectional Technologies | 3 | Active |
| US7341934B2 | Method for fabricating conductive bump of circuit board | Electricity | 3 | Expired |
| US7151050B2 | Method for fabricating electrical connection structure of circuit board | Electricity | 3 | Expired |
| US7674362B2 | Method for fabrication of a conductive bump structure of a circuit board | Electricity | 3 | Active |
| US7847400B2 | Semiconductor package substrate structure and manufacturing method thereof | Electricity | 2 | Active |
| US7659193B2 | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof | Emerging Cross-Sectional Technologies | 2 | Active |
| US9107332B2 | Method for manufacturing printed circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US8058564B2 | Circuit board surface structure | Electricity | 1 | Active |
| US8188377B2 | Circuit board having electrically connecting structure and fabrication method thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US10707000B2 | Integrated driving module with energy conversion function and manufacturing method thereof | Electricity | 0 | Active |
| US8269354B2 | Semiconductor package substrate structure and manufacturing method thereof | Electricity | 0 | Active |
| US11495379B2 | Manufacturing method of an integrated driving module with energy conversion function | Electricity | 0 | Active |
| US9711444B2 | Packaging module and substrate structure thereof | Electricity | 0 | Active |
| US9439282B2 | Method for manufacturing printed circuit board | Electricity | 0 | Active |
| US9439281B2 | Method for manufacturing printed circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.