Pattern measurement method, manufacturing method of semiconductor device, pattern measurement apparatus, and program
US7151855B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | May 15, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A pattern measurement method includes acquiring graphic data of a plurality of patterns including image data; processing the graphic data to detect a coordinate of an edge point of the pattern; combining the edge points between the patterns to make a pair of edge points and calculating a distance between the edge points constituting each pair of edge points and an angle between a straight line which connects the edge point to the other edge point and an arbitrary axial line with respect to each pair of edge points to prepare a distance angle distribution map which is a distribution map of the calculated distance and angle of the pair of edge points; and evaluating at least one of a relation of shape between the patterns, a relation of size between the patterns, and a relative location between the patterns on the basis of the prepared distance angle distribution map.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.