Sensor usable in ultra pure and highly corrosive environments
US7152478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/069
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The electrical pin lead structure and brazing technique of the present invention provide a brazed lead in a sensor that adheres well to a semiconductor substrate while facilitating lateral flexibility without joint fatigue or breakage. In one example embodiment, the pin lead includes a coil head that is brazed to a silicon layer on a sapphire substrate using a silver-copper-palladium braze material. An advantage to this approach is the ability to both braze the pin lead to the diaphragm and seal the diaphragm to the ceramic backing plate with a high temperature glass in a single process step. Further, the palladium in the braze composition is a factor in reducing surface tension between the metal lead and semiconductor substrate during cooling to avoid stress fractures in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.