Method and apparatus for producing uniform isotropic stresses in a sputtered film
US7153399B2 · kind B2 · utility
6Cited by
11References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Aug 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of transport speed are presented, which together allow the achievement of the maximum stress that the film material can hold while avoiding X-Y stress anisotropy and avoiding stress non-uniformity across the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.