Nanonexus, Inc.
19Patents
3Active
19Granted
38Portfolio score
Filing activity: Nov 21, 2001 → Jul 17, 2008 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6917525B2 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | Emerging Cross-Sectional Technologies | 137 | Expired |
| US6812718B1 | Massively parallel interface for electronic circuits | Physics | 134 | Expired |
| US6791171B2 | Systems for testing and packaging integrated circuits | Electricity | 76 | Expired |
| US6815961B2 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Electricity | 73 | Expired |
| US7349223B2 | Enhanced compliant probe card systems having improved planarity | Emerging Cross-Sectional Technologies | 70 | Expired |
| US7621761B2 | Systems for testing and packaging integrated circuits | Electricity | 63 | Active |
| US7579848B2 | High density interconnect system for IC packages and interconnect assemblies | Physics | 57 | Expired |
| US6799976B1 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Electricity | 49 | Expired |
| US7382142B2 | High density interconnect system having rapid fabrication cycle | Emerging Cross-Sectional Technologies | 35 | Expired |
| US7126220B2 | Miniaturized contact spring | Electricity | 31 | Expired |
| US7247035B2 | Enhanced stress metal spring contactor | Electricity | 31 | Expired |
| US7009412B2 | Massively parallel interface for electronic circuit | Physics | 30 | Expired |
| US7138818B2 | Massively parallel interface for electronic circuit | Physics | 9 | Expired |
| US7126358B2 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies | Electricity | 9 | Expired |
| US7403029B2 | Massively parallel interface for electronic circuit | Physics | 8 | Active |
| US7137830B2 | Miniaturized contact spring | Electricity | 7 | Expired |
| US7153399B2 | Method and apparatus for producing uniform isotropic stresses in a sputtered film | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6710609B2 | Mosaic decal probe | Physics | 2 | Expired |
| US7772860B2 | Massively parallel interface for electronic circuit | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.