Micromechanical component as well as a method for producing a micromechanical component
US7153718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Sep 7, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.