Communication semiconductor integrated circuit device and wireless communication system
US7154341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Feb 4, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L7/199
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A communication semiconductor integrated circuit device includes an RFVCO and a TXVCO and is formed over one semiconductor substrate, and has a first operation mode (idle mode) which does not perform transmission and reception, a second operation mode (warmup mode) which performs a preparation prior to the start of transmission or reception, and a third operation mode (transmission or reception mode) which performs transmission or reception. In the first operation mode, two oscillators are deactivated, and the operation of selecting a frequency band to be used in at least the TXVCO which generates a transmit signal, is performed in the second operation mode. In the communication semiconductor integrated circuit device, a high frequency signal generator which generates a signal having a desired frequency with an oscillation signal outputted from a crystal oscillator as a reference signal, a reception system circuit (RXC) including a frequency converter, and a transmission system circuit (TXC) including the TXVCO which generates the transmit signal, are respectively formed in different semiconductor regions isolated by insulators.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.