Thermal protrusion reduction in magnet heads by utilizing a heat-spreading pad
US7154708B2 · kind B2 · utility
22Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jul 12, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.