Power amplifier module
US7154760B2 · kind B2 · utility
19Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Oct 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.