Method and system for dynamic modeling and recipe optimization of semiconductor etch processes
US7155301B2 · kind B2 · utility
3Cited by
1References
39Claims
0Family size
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Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Aug 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method and system are disclosed for creating dynamic models of etch processes in semiconductor manufacturing. In one embodiment, a method comprises modeling an etch process used in semiconductor manufacturing to generate a dynamic process model. The dynamic process model is used to determine input values that result in a desired output value. A process recipe is optimized for the etch process with the input values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.