System and method for heating and cooling wafer at accelerated rates
US7156924B2 · kind B2 · utility
8Cited by
18References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different points of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.