Method and device for continuous cold plasma deposition of metal coatings
US7156960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an inlet (21) and an outlet (22) for the substrate with a source of metal vapor between them, made up of an electrode to form a plasma (6) with the substrate or a separate electrically conducting element as a counter-electrode. The deposition metal is introduced in the liquid state in a retention tank (8) and is maintained as a liquid at an essentially constant level during the formation of the metal layer on the substrate. An Independent claim is included for the device used to put this method of coating a substrate into service.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.