Wire bonder
US7159751B2 · kind B2 · utility
2Cited by
19References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Jun 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.