Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US7160429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4647
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.