Method for producing electronic componets

US7160478B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Jürgen Leib · Freising, DE
• Florian Bieck · Singapore, SG

Key dates

• Filing date: Aug 26, 2002
• Grant date: Jan 9, 2007
• Expiry date: Dec 1, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/806

Abstract

A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.