Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element
US7161242B2 · kind B2 · utility
6Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Apr 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing member is larger than the opening forming portion, provided in the substrate body at a portion corresponding to the opening forming portion, and reinforces the substrate body at the portion corresponding to the opening forming portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.