Polishing composition for noble metals
US7161247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Apr 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and α-hydroxycarbonyl compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.