Polishing method
US7163895B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2003 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Nov 21, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.