Wafer stage with a magnet
US7164571B2 · kind B2 · utility
3Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2005 |
| Grant date | Jan 16, 2007 |
| Priority date | — |
| Expiry date | Mar 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer stage for holding a wafer in a chamber of a plasma processing system, the wafer stage includes an electrode on which a wafer is placed, to which electrical current is supplied, a diameter of the electrode is larger than a diameter of said wafer, a plurality of magnets separately arranged on an outermost region of said electrode and said magnets are arranged such that alternate magnetic poles face towards the inside of the chamber, and an outer-ring placed around said wafer, the outer ring having a magnetic metal ring at a lower side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.