Encapsulation of electronic devices

US7166007B2 · kind B2 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• Institute of Materials Research and Engineering · SG

Inventors

• Mark Auch · Singapore, SG
• Ewald Guenther · Regenstauf, DE
• Lim Shuang Fang · Singapore, SG
• Chua Soo Jin · Singapore, SG

Key dates

• Filing date: Nov 4, 2004
• Grant date: Jan 23, 2007
• Expiry date: Apr 9, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/8722

Abstract

A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.