Thermoplastic fluxing underfill composition and method
US7166491B2 · kind B2 · utility
4Cited by
26References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2003 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | Oct 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.