Compact pressure sensor with high corrosion resistance and high accuracy
US7168326B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2005 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | May 11, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L23/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.