Ichiharu Kondo
10Patents
6h-index
19Co-inventors
59Inventor score
Filing activity: Jul 17, 1992 → May 26, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5656858A | Semiconductor device with bump structure | Electricity | 197 | Expired |
| US5635764A | Surface treated structure for solder joint | Electricity | 18 | Expired |
| US5360765A | Method of forming electrodes of semiconductor device | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6548386B1 | Method for forming and patterning film | Electricity | 10 | Expired |
| US7030496B2 | Semiconductor device having aluminum and metal electrodes and method for manufacturing the same | Electricity | 8 | Expired |
| US5876861A | Sputter-deposited nickel layer | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5614291A | Semiconductor device and method of manufacturing the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7176541B2 | Pressure sensor | Physics | 4 | Expired |
| US7168326B2 | Compact pressure sensor with high corrosion resistance and high accuracy | Physics | 2 | Expired |
| US7242065B2 | Compact pressure sensor with high corrosion resistance and high accuracy | Physics | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.