System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
US7168939B2 · kind B2 · utility
16Cited by
13References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0017
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.