Inventor · Thalwil, CH

Bruno Michel

101Patents
16h-index
93Co-inventors
89Inventor score

Filing activity: Oct 8, 1991 → Mar 11, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US5817242A Stamp for a lithographic process Physics 158 Expired
US5925259A Lithographic surface or thin layer modification Electricity 102 Expired
US7928565B2 Semiconductor device with a high thermal dissipation efficiency Electricity 68 Active
US5804709A Cantilever deflection sensor and use thereof Emerging Cross-Sectional Technologies 64 Expired
US7808780B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 37 Active
US8363402B2 Integrated circuit stack Electricity 32 Active
US6596346B2 Silicone elastomer stamp with hydrophilic surfaces and method of making same Emerging Cross-Sectional Technologies 27 Expired
US7866173B2 Variable performance server system and method of operation Physics 27 Active
US6096386A Method of oriented depositing chemically defined bodies Chemistry; Metallurgy 25 Expired
US7547582B2 Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies Electricity 24 Active
US8413712B2 Cooling device Electricity 23 Active
US6794589B2 Multiple electrical switch arrangement Electricity 23 Expired
US6521285B1 Method for printing a catalyst on substrates for electroless deposition Performing Operations; Transporting 19 Expired
US7740472B2 Method and device for flowing a liquid on a surface Emerging Cross-Sectional Technologies 18 Active
US6569575B1 Optical lithography beyond conventional resolution limits Physics 18 Expired
US6798464B2 Liquid crystal display Physics 17 Expired
US7168939B2 System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning Physics 16 Expired
US8004832B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 16 Active
US7255153B2 High performance integrated MLC cooling device for high power density ICS and method for manufacturing Emerging Cross-Sectional Technologies 15 Expired
US8106505B2 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Electricity 12 Active
US7235464B2 Patterning method Emerging Cross-Sectional Technologies 12 Expired
US8427833B2 Thermal power plane for integrated circuits Emerging Cross-Sectional Technologies 12 Active
US7271034B2 Semiconductor device with a high thermal dissipation efficiency Electricity 11 Expired
US8107234B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 11 Active
US7748440B2 Patterned structure for a thermal interface Emerging Cross-Sectional Technologies 11 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.