Laser micromachining method
US7169687B2 · kind B2 · utility
22Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Dec 1, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser uses multiphoton absorption to lower the ablation threshold of portions of the workpiece prior to a second laser ablating the portions of the workpiece. In an alternative embodiment, a first laser uses high energy single-photon absorption to lower the ablation threshold of portions of the workpiece prior to a second laser ablating the portions of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.