Inventor · Chandler, AZ, US

Eric J. Li

51Patents
7h-index
65Co-inventors
71Inventor score

Filing activity: Aug 20, 2004 → Jul 8, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US7169687B2 Laser micromachining method Performing Operations; Transporting 22 Expired
US7393468B2 Adhesive with differential optical properties and its application for substrate processing Emerging Cross-Sectional Technologies 15 Active
US7279362B2 Semiconductor wafer coat layers and methods therefor Electricity 13 Expired
US10121722B1 Architecture material and process to improve thermal performance of the embedded die package Electricity 9 Active
US8193072B2 Semiconductor wafer coat layers and methods therefor Electricity 8 Active
US7118989B2 Method of forming vias on a wafer stack using laser ablation Electricity 7 Expired
US10418329B2 Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate Electricity 7 Active
US7897486B2 Semiconductor wafer coat layers and methods therefor Electricity 7 Active
US9685413B1 Semiconductor package having an EMI shielding layer Electricity 6 Active
US9741692B2 Methods to form high density through-mold interconnections Electricity 6 Active
US7807573B2 Laser assisted chemical vapor deposition for backside die marking and structures formed thereby Electricity 6 Active
US10573608B2 Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package Electricity 6 Active
US9842818B2 Variable ball height on ball grid array packages by solder paste transfer Electricity 6 Active
US9922751B2 Helically insulated twinax cable systems and methods Electricity 5 Active
US7611966B2 Dual pulsed beam laser micromachining method Electricity 5 Expired
US7767563B2 Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure Electricity 4 Active
US11075166B2 Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate Electricity 3 Active
US10163810B2 Electromagnetic interference shielding for system-in-package technology Electricity 3 Active
US9659899B2 Die warpage control for thin die assembly Electricity 2 Active
US10256198B2 Warpage control for microelectronics packages Electricity 2 Active
US10373888B2 Electronic package assembly with compact die placement Electricity 2 Active
US9390968B2 Low temperature thin wafer backside vacuum process with backgrinding tape Electricity 2 Active
US10707171B2 Ultra small molded module integrated with die by module-on-wafer assembly Electricity 2 Active
US9991211B2 Semiconductor package having an EMI shielding layer Electricity 2 Active
US7553386B2 Adhesive with differential optical properties and its application for substrate processing Emerging Cross-Sectional Technologies 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.