Method and apparatus for deflashing of integrated circuit packages
US7170029B2 · kind B2 · utility
3Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2004 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Aug 5, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.