MEMS RF switch module including a vertical via
US7170155B2 · kind B2 · utility
14Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | May 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electrically couple an RF switch array of the MEMS die to a printed circuit board (PCB). In one embodiment, the MEMS die includes a trace ring surrounding at least a portion of the RF switch array so that a signal may enter or exit the MEMS RF switch module using the vertical via without crossing the trace ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.