Apparatus and method for terminating probe apparatus of semiconductor wafer
US7170305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2005 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.