Method of reviewing detected defects
US7170593B2 · kind B2 · utility
17Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Jan 30, 2007 |
| Priority date | — |
| Expiry date | Oct 11, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method to solve the problem of a technique generally used to detect a defect of a semiconductor by calculating the differential image based on pattern matching, which requires that a reference image must be picked up to pick up an image of the inspection position in an area with the semiconductor pattern having no periodicity, resulting in a low throughput. The image of the inspection position is divided into local areas, each local area is matched with the local area of the image already stored and the difference between the local areas thus matched is determined to extract a defect area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.