Stacked multiple connection module
US7172432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2005 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.