Deflectable microstructure and method of manufacturing the same through bonding of wafers
US7172911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/058
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of making a deflectable, free hanging micro structure having at least one hinge member, the method includes the steps of providing a first sacrificial wafer having a single crystalline material constituting material forming the micro structure. A second semiconductor wafer including necessary components for forming the structure in cooperation with the first wafer is provided. Finite areas of a structured bonding material is provided, on one or both of the wafers at selected locations, the finite areas defining points of connection for joining the wafers. The wafers are bonded using heat and optionally pressure. Sacrificial material is etched away from the sacrificial wafer, patterning the top wafer by lithography is performed to define the desired deflectable microstructures having hinges, and subsequently silicon etch to make the structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.