SILEX MICROSYSTEMS AB
32Patents
26Active
32Granted
49Portfolio score
Filing activity: Jun 7, 2002 → Feb 10, 2016 · 5 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7017420B2 | Miniaturized pressure sensor | Physics | 25 | Expired |
| US6973835B2 | Pressure sensor | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7560802B2 | Electrical connections in substrates | Electricity | 16 | Expired |
| US7207227B2 | Pressure sensor | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7172911B2 | Deflectable microstructure and method of manufacturing the same through bonding of wafers | Performing Operations; Transporting | 13 | Expired |
| US8308960B2 | Methods for making micro needles and applications thereof | Electricity | 11 | Active |
| US8637351B2 | Methods for making micro needles and applications thereof | Electricity | 10 | Active |
| US8485416B2 | Bonding process and bonded structures | Electricity | 6 | Active |
| US9240373B2 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Electricity | 6 | Active |
| US9362139B2 | Method of making a semiconductor device having a functional capping | Electricity | 5 | Active |
| US9224681B2 | CTE matched interposer and method of making | Electricity | 4 | Active |
| US9484293B2 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Electricity | 3 | Active |
| US9514985B2 | Electroless metal through silicon via | Electricity | 3 | Active |
| US9355895B2 | Method of providing a via hole and routing structure | Electricity | 2 | Active |
| US9718674B2 | Thin capping for MEMS devices | Electricity | 2 | Active |
| US8324103B2 | Vias and method of making | Electricity | 2 | Active |
| US9620390B2 | Method of making a semiconductor device having a functional capping | Electricity | 1 | Active |
| US8592981B2 | Via structure and method thereof | Electricity | 1 | Active |
| US9607915B2 | Through substrate vias and device | Electricity | 1 | Active |
| US9249009B2 | Starting substrate for semiconductor engineering having substrate-through connections and a method for making same | Electricity | 0 | Active |
| US9507142B2 | Precise definition of transducer electrodes | Electricity | 0 | Active |
| US8866289B2 | Bonding process and bonded structures | Electricity | 0 | Active |
| US8729713B2 | Via structure and method thereof | Performing Operations; Transporting | 0 | Active |
| US8598676B2 | Barrier structure | Electricity | 0 | Active |
| US9511999B2 | Thin film capping | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.