Multi-layer film stack for extinction of substrate reflections during patterning
US7172960B2 · kind B2 · utility
3Cited by
26References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2000 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Dec 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/958
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including introducing a dielectric layer over a substrate between an interconnection line and the substrate, the dielectric layer comprising a plurality of alternating material layers; and patterning an interconnection to the substrate. An apparatus comprising a substrate comprising a plurality of devices formed thereon; and an interlayer dielectric layer comprising a base layer and a cap layer, the cap layer comprising a plurality of alternating material layers overlying the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.