Process for the wet chemical treatment of semiconductor wafers

US7172975B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Roland Brunner · Wien, AT
• Helmut Schwenk · Burghausen, DE
• Johann Zach · Pfarrkirchen, DE

Key dates

• Filing date: Oct 22, 1999
• Grant date: Feb 6, 2007
• Expiry date: Jul 6, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02052
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process for the wet chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with treatment liquids, has the semiconductor wafers firstly treated with an aqueous HF solution, then treated with an aqueous O3 solution and finally treated with water or an aqueous HCl solution, these treatments forming a treatment sequence.