Substrate processing apparatus and method
US7172979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2002 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Dec 26, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/0288
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.