Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board
US7173193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Feb 6, 2007 |
| Priority date | — |
| Expiry date | Feb 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.